Key Takeaways from ECOC Exhibition
This year’s event highlighted two important trends in fiber arrays:

We can see that different optical chips can be integrated with electronic chips, reducing the number of fiber-to-PIC couplings per optical module.

What wasn’t a major issue two years ago has now become a focal point for many telecom and datacom companies. Companies prioritize high-quality fiber arrays despite higher costs for more consistent testing and characterization results.

It’s great to watch the industry evolve and invest in long-term solutions!